Process condition sensing wafer and data analysis system

ABSTRACT

A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor wafer processing, LCDdisplay glass substrate processing, magnetic memory disc processing andother devices fabricated from thin film processes and more specificallyto a substrate which can sense and transmit processing conditions.

2. Discussion of the Related Art

The fabrication of an integrated circuit, display or disc memorygenerally employs numerous processing steps. Each process step must becarefully monitored in order to provide an operational device.Throughout the imaging process, deposition and growth process, etchingand masking process, etc., it is critical, for example, thattemperature, gas flow, vacuum pressure, chemical gas or plasmacomposition and exposure distance be carefully controlled during eachstep. Careful attention to the various processing conditions involved ineach step is a requirement of optimal semiconductor or thin filmprocesses. Any deviation from optimal processing conditions may causethe ensuing integrated circuit or device to perform at a substandardlevel or, worse yet, fail completely.

Within a processing chamber, processing conditions vary. The variationsin processing conditions such as temperature, gas flow rate and/or gascomposition greatly affect the formation and thus the performance of theintegrated circuit. Using a substrate to measure the processingconditions that is of the same or similar material as the integratedcircuit or other device provides the most accurate measure of theconditions because the thermal conductivity of the substrate is the sameas the actual circuits that will be processed. Gradients and variationsexist throughout the chamber for virtually all process conditions. Thesegradients therefore also exist across the surface of a substrate. Inorder to precisely control processing conditions at the wafer, it iscritical that measurements be taken upon the wafer and the readings beavailable in real time to an automated control system or operator sothat the optimization of the chamber processing conditions can bereadily achieved. Processing conditions include any parameter used tocontrol semiconductor or other device manufacture or any condition amanufacturer would desire to monitor.

Within the processing chamber a robot head transports the test wafer orsubstrate. One example of a device incorporating a robot head ismanufactured by the TEL Corporation. The robot head can pivot. The robothead also incorporates multiple levels or hands. A first level or handcan extend out and a second level or hand can further extend outcarrying a wafer. A second robot or moving platform can receive thewafer and extend it to a third holder which lowers it into the processchamber. For more information about the robot head and processingchamber, please refer to U.S. Pat. No. 5,564,889 to Araki, entitled“Semiconductor Treatment System and Method for Exchanging and TreatingSubstrate,” which is hereby incorporated by this reference in itsentirety.

SUMMARY OF THE INVENTION

Placement of sensors directly upon or in the substrate and spacedthroughout the substrate surface yields an accurate gradient reading ofvarious processing conditions upon the surface of the wafer. Theprocessing conditions may be stored in memory for later evaluation orare available in real time to be read via a remote data processingdevice such as a computer, PDA or any other microprocessor controlleddevice that can present information and receive input from a controlsystem or operator. The operator can monitor the processing conditionsin real time, and then alter the settings of the processing chamber toreach an ideal state while continuing to monitor the effects, or thismay be accomplished by an automated optimization and control system.Additionally, subsequent processing steps can be instantaneouslymodified based on a process condition of a prior step.

Distancing sensitive electronic circuitry from the processing conditionsresults in a wider operating range and more accurate, reliable,repeatable and drift-free operation.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1A is a perspective view of PCMD 100, a first embodiment of theinvention, in an extended state.

FIG. 1B is a perspective view of PCMD 100 in a concentric state.

FIG. 1C is a top view of a processing chamber and robot hand.

FIG. 1D is a top view of a robot hand extending.

FIG. 1E is a plan view of a robot hand extending.

FIG. 1F is a schematic of the electronics and circuitry common to allembodiments.

FIG. 1G is a cross section of substrate 104.

FIG. 1H is a top view of substrate 104.

FIG. 1J is a perspective view of a sensor in substrate 104.

FIG. 2 is a perspective view of PCMD 200, another embodiment of theinvention.

FIG. 3A is a perspective view of PCMD 300, another embodiment of theinvention.

FIG. 3B is a plan view of PCMD 300.

FIG. 4 is a perspective view of PCMD 400, another embodiment of theinvention.

FIG. 5 is a perspective view of PCMD 500, another embodiment of theinvention.

FIG. 6 is a perspective view of PCMD 600, another embodiment of theinvention.

FIG. 7 is a perspective view of PCMD 700, another embodiment of theinvention.

DETAILED DESCRIPTION OF THE INVENTION

The measurement system of the present invention measures processingconditions in various locations of a wafer or substrate and transmitsthem in real time to a data processing device or records them in memoryfor later transmission or downloading of process conditions.

As defined herein, “processing conditions” refer to various processingparameters used in manufacturing an integrated circuit. Processingconditions include any parameter used to control semiconductormanufacture or any condition a manufacturer would desire to monitor suchas but not limited to temperature, processing chamber pressure, gas flowrate within the chamber, gaseous chemical composition within thechamber, ion current density, ion current energy, light energy density,and vibration and acceleration of the wafer.

The invention will now be described with reference to the figures.

FIG. 1A illustrates processing condition measuring device (“PCMD”)100, afirst embodiment of the invention, in an extended position. PCMD 100 hastwo principal pieces, substrate 104 and electronics disc 106. Thesubstrate 104 is used to measure the processing conditions ofsemiconductor manufacturing equipment, glass substrate processingequipment, and magnetic memory disc processing equipment. Specifically,it is used to measure the conditions that a wafer or substrate undergoesduring processing. Sensors are arranged in different areas on thesurface or within substrate 104 in order to measure the processingconditions across the substrate. By measuring in different areas of thesubstrate, the gradient across the substrate can be calculated, andadditionally, the condition at a particular location of the substratecan be correlated to the resultant characteristics of the substrate. Thenumber of sensors in/on substrate 104 will vary upon the processingcondition being measured and the size of substrate 104. In oneembodiment for measuring temperature, a 200 mm diameter substrate has 17sensors whereas a 300 mm diameter substrate has 29 sensors. Substrate104 will be discussed later in more detail with regard to FIGS. 1G-1H.

Electronics disc 106 is connected to substrate 104 by cable 108. Cable108 can be any type of cable but is preferably a flat ribbon type cablethat is flexible and has a low profile. The processing conditions thatPCMD will be subjected to often involve high or variable temperatures orother conditions, both of which negatively affect the functionality,accuracy, and reliability of electronic components. Furthermore,numerous other processing steps and conditions make it advantageous todistance the electronics from the process or even to locate theelectronics outside of the processing environment. Separating the PCMDinto two pieces, in this embodiment, allows the substrate and thesensors to be inside of the processing chamber while the electronics canremain outside of the chamber free from the deleterious effects of theelevated temperature and the other various processing conditions. Cable108 of PCMD 100 thus may pass from the exterior to the interior of theprocessing chamber under a chamber seal to allow the process to proceedwithout risk of leakage of the process atmosphere to or from theexterior environment. The cable is preferably made of a materialresistant to temperature and other gaseous chemicals used in themanufacturing process such as polyimide.

Data processing device (“DPD”) 110 is connected to electronics disc 106with telecommunications link 112 at data port 114. Telecommunicationslink 112 may be a wired or wireless link and will be described later infurther detail with regard to FIG. 1F.

FIG. 1B shows substrate 104 and electronics disc 106 concentricallylocated with cable 108 between them. Concentric is hereby defined as thecircumference of one circle being within the circumference of anothercircle, the circles not necessarily having the same center. Thus, thisdefinition also encompasses eccentricity of the circles.

Concentrically located, they can be loaded into two robot arms spacedone above the other. The substrate 104 with the sensors would be held bythe lower robot arm. The lower arm may be extended for insertion of thesubstrate 104 into a processing chamber. The processing chamber hasthree areas for insertion: area 134, area 136, and area 138. FIG. 1Cillustrates a robot head 130 inserting PCMD 100 into various areas of aprocessing chamber 132. Robot hands 130 a (above, holding theelectronics disc 106) and robot hand 130 b (below, holding the substrate104) are both capable of independently extending. FIGS. 1D and 1Eillustrate three hands 130 a, 130 b, and 130 c of robot head 130. InFIG. 1D, level robot hand 130 b is extended away from robot hand 130 aof robot hand 130. Level 130 b or 130 c would contain substrate 104, andlevel 130 a or 130 b, respectively, would contain electronics disc 106when PCMD 100 is in its extended state. The robot head 130 would firsthave PCMD in its concentric state as seen in FIG. 1B as it approachesthe chamber. Robot hand 130 b would then extend away from hand 130 a andthus separate substrate 104 from electronics disc 106. In this way,substrate 104 can be placed into area 134 as seen in FIG. 1C. If PCMDwere to be placed into area 136, robot hands 130 a and 130 b would beinserted into area 136 with PCMD 100 in its concentric state. Thesubstrate 104 would be lowered onto a sliding platform which would movesubstrate 104 to the process chamber at position 136. Prior to loadinginto robot hands 130 a and 130 b, PCMD 100 would be rotated to a properorientation so that it could be extended along the axis of cable 108.Placement of substrate 104 into process chamber 138 would besubstantially the same as for chamber 136 except for a differentrotation angle to allow the extension along the axis of cable 108 to bein line with chamber 138.

FIG. 1F is a block diagram illustrating the electrical circuits andsignal flow of PCMD circuitry 151 and DPD 110, which is common to allthe embodiments of the invention. Sensors 150, as mentioned previously,are in or on substrate 104. The output of sensors 150 is coupled to SAC154 via conductors 153. Memory 152 is optional and is preferably locatednear sensors 150 either on substrate 104 or on a connector of cable 108.Memory 152, if present, stores digital sensor data which is passedthrough SAC 154 without processing and continues through conductors 156to DTC 158 for reading of the digital sensor data by themicro-controller 158B. Memory 152 may contain calibration coefficientsfor the sensors 150. In this way, even if the electronics disc 106 ischanged, memory 152 and the calibration coefficients will remain withthe appropriate sensors 150. SAC 154 is preferably located atelectronics disc 106 but may be located at substrate 104 or anywherewithin or external of the process chamber. SAC 154 contains thecircuitry necessary to pick up the sensor outputs and if necessaryprovide any input power or other signals needed to drive the sensorssuch as amplifiers, current sources, and filters. SAC 154 drives thesignal to data transmission circuitry (“DTC”) 158 over conductors 156.Power supply 162 can be a storage cell, radiative energy conversioncell, or inductive coupled power source and powers all the components ofPCMD 100 via electrical bus 164.

DTC 158 comprises the circuitry necessary to process, store and transmitthe signals in analog or digital form from SAC 154 to DPD 110 over datalink 112. In the case that the signals are sent digitally, DTC 158 mayinclude one or more analog to digital converters 158A. A transceiver158C within DTC 158 sends and receives the measured processingconditions and any control signals to and from transceiver 110 d of DPD110. Although transceiver 110 d is shown as part of DPD 110, it may alsobe remotely located on robot head 130. DTC 158 may also containcalibration coefficients for the sensors 150. DTC 158 may read thecalibration coefficient information and communicate it to dataprocessing device 110 for applying the calibration correction to themeasured data. DTC 158 may also optionally contain memory 158D to storethe recorded processing conditions as measured by sensors 150 in the rawor corrected state, as well as other information such as the calibrationcoefficients. Microcontroller or gate array 158B manages the processesof DTC 158. Data link 112 may be a wireless link or may be a multiconductor data cable such as an RS 232 or universal serial bus (USB)connection. In the case that data link 112 is wireless, the transceivers158 c and 110 d can communicate with infrared, acoustic, sonic,ultrasonic, or radio frequency signals. Any number of well-knownprotocols may be employed such as Bluetooth. The transceiver may alsosend and receive signals inductively. In PCMD 100, DTC 158 is a part ofelectronics disc 106, whereas in the following embodiments it may belocated elsewhere. For clarity, interconnects or wiring within SAC 154,DTC 158 and DPD 110 have not been shown.

Data processing device 110 can be any microprocessor or gate arraycontrolled device such as a computer or a personal digital assistant(“PDA”) or a purpose built computer. DPD 110 includes a centralprocessing unit 110A and may also include input/output devices 110B suchas a display or keyboard, mouse etc . . . , memory 110C, and transceiver110D.

Substrate 104 has a base layer 140 that is preferably a silicon wafer,but can also be made out of numerous other materials that may be used inmanufacturing integrated circuits or thin film devices including glass,ceramic, GaAs, carbide or nitride. Substrate 104 and electronics disc106 are preferably 200 mm or 300 mm in diameter to simulate the size ofcurrent wafers and in order to be handled by conventional wafer handlingmachinery; however, they may be of any diameter or any shape.

FIG. 1G is a cross section of substrate 104. In this illustrativeexample, base layer 140 is a silicon wafer with various layers formedupon the wafer. Base layer 140 has an insulating layer 142 upon baselayer 140. Insulating layer 142 can be any insulative material but ispreferably a thermal oxide such as silicon dioxide. A cap layer 144 isthen formed on the top of insulating layer 142. Cap layer 144compensates for any defects in insulating layer 142. Upon cap layer 144is interconnect layer 146. Interconnect layer 146 is a conductive layerthat is used to transfer the signals to and from the sensors monitoringthe process conditions. Interconnect layer 146 is etched to form circuittraces leading to and from the precise location of the sensors, and anybond pads needed for interconnection. Additionally, the sensorsthemselves may be formed within interconnect layer 146, and within otherconductive layers (not shown). Upon interconnect layer 146 ispassivation layer 148. Passivation layer 148 is preferably a nitridelayer but can be any type of dielectric material. FIG. 1H illustratesthe preferred layout of sensors 150 on/in substrate 104, although manydifferent layouts are possible and within the scope of the invention.FIG. 1J illustrates a discrete sensor 150 mounted in substrate 104 andconnected to circuit traces formed in interconnect layer 146. Athermally conductive insulating ceramic material (not shown) coverssensor 150 and fills cavity 152. For more information on the sensors andinterconnects made in a thin film layer directly deposited on thesubstrate, please refer to U.S. Pat. No. 6,190,040 B1 to Renken et al.,entitled “Apparatus for Sensing Temperature on a Substrate in anIntegrated Circuit Fabrication Tool,” which is hereby incorporated bythis reference in its entirety.

Sensors 150 are necessary for detecting various processing conditionsare mounted on or fabricated in substrate 104 according to well knownsemiconductor transducer design. For measuring temperature, a populartransducer is an RTD or thermistor, which includes a thin-film resistormaterial having a temperature coefficient. A magneto-resistive materialmay also be used to measure the amount of magnetic flux exerted uponsubstrate 104. A resistance-to-voltage converter is often formed withinthe substrate between distal ends of the resistive-sensitive material(either thermistor or magneto-resistive material). Another exemplarytemperature sensor includes a thermocouple made of two dissimilarconductors lithographically formed in the layers of the substrate. Whenthe junction between the conductors is heated, a small thermoelectricvoltage is produced which increases approximately linearly with junctiontemperature. Another example of a temperature sensor includes a diodethat produces a voltage that increases with temperature. By connectingthe diode between a positive supply and a load resistor,current-to-voltage conversion can be obtained from the load resistor.Another sensor is a piezoelectric device such as a quartz tuning forkfabricated from quartz crystal cut on a crystal orientation whichexhibits a temperature dependent frequency of oscillation. The sensor'soscillating frequency can be referenced against a master oscillatorformed by a piezoelectric device such as a quartz tuning fork which isfabricated from a crystal orientated to minimize frequency change withtemperature. The frequency difference between the sensor and masteroscillator would provide a direct digital temperature dependent signal.Piezoelectric sensors may also be used to sense mass change to measuredeposition mass and rates or other process conditions.

Sensors 150 may also be used to measure pressure, force or strain atselect regions across substrate 104, either as a discrete sensor or asensor integrally formed in the layers of substrate 104. There are manytypes of pressure transducers capable of measuring the atmosphericpressure exerted upon the wafer. A suitable pressure transducer includesa diaphragm-type transducer, wherein a diaphragm or elastic elementsenses pressure and produces a corresponding strain or deflection whichcan then be read by a bridge circuit connected to the diaphragm orcavity behind the diaphragm. Another suitable pressure transducer mayinclude a piezoresistive material placed within the semiconductorsubstrate of substrate 104. The piezoresistive material is formed bydiffusing doping compounds into the substrate. The resultingpiezoresistive material produces output current proportional to theamount of pressure or strain exerted thereupon.

Sensors 150 may also be used to measure flow rate across substrate 104.In addition, humidity and moisture sensors can also be formed uponsubstrate 104. A well-known method for measuring flow rate, a hot-wireanemometer, may be incorporated into substrate 104. Fluid velocity isbased upon the frequency of vortex production as a streamlined fluidicflow strikes a non-streamlined obstacle formed upon substrate 104.Measurement of fluid flow generally involves the formation of specialvortices on either side of the obstacle. Thus, an alternating pressuredifference occurs between the two sides. Above a threshold (below whichno vortex production occurs), the frequency is proportional to fluidvelocity. Of many methods of detecting the alternating pressuredifference, a hot thermistor is preferably placed in a small channelbetween the two sides of the obstacle. The alternating directions offlow through the capitalized channel periodically cool the self-heatedthermistor thereby producing an AC signal and corresponding electricpulses at twice the vortex frequency. Therefore, an obstacle protrudingfrom substrate 104 in front of a thermistor can provide solid-state flowrate measurement. Heat can be transferred between self heatedthermistors placed in close proximity to each other. Fluid flowtransfers thermal energy between the adjacent thermistors causing athermal imbalance proportional to mass flow. Two or more adjacentsensors can be arrayed to measure flow along a vector, or multiple flowvectors may also be sensed. The thermal imbalance can be detected toproduce a DC signal related to mass flow. Flows in multiple directionscan be compared to detect flow vectors.

Sensors 150 can also be used to measure the gaseous chemicalconcentration placed upon substrate 104. Chemical composition sensorsutilize a membrane which is permeable to specific ions to be measured.Ideally, the membrane should be completely impermeable to all otherions. The conductivity of the membrane is directly proportional to thetransport of select ions which have permeated the membrane. Given thevariability of membrane conductivity, measurements can be taken whichdirectly correlate to the amount of chemical ions present within theambient surrounding substrate 104.

Sensors 150 may also be used to measure ion current density and ioncurrent energy with a parallel plate structure, an array of collectingplates, and collecting plates with control grids supported above thecollecting plates. The current flowing between parallel plates, or tothe array of collecting plates will increase with ion current density.Ion current energy can be detected by applying a constant or varying DCpotential on the grids above the plates. This will modulate current flowwith ion current energy allowing the energy distribution to be detected.This is useful in monitoring and regulating a deposition or etchingprocess.

A piezoelectric transducer/sensor may also be integrated into substrate104 to measure the resonant frequency of a layer and thus the mass orthickness of the layer.

Additionally, sensors 150 can also be used to detect a change inposition or displacement of an object spaced from substrate 104.Exemplary displacement transducers include electro-optical devices whichcan measure photon energy (or intensity) and convert photon energy to anelectric field or voltage. Relatively well known electro-optical devicesinclude light-emitting diodes, photodiodes, phototransistors, etc.,which can be formed upon a semiconductor substrate. Displacement sensorsare used to provide accurate information about electrode spacing withinan etch or deposition chamber, and can also provide spacing informationbetween a wafer and corresponding masks and/or radiation source.

FIG. 2 illustrates another embodiment of a process condition measuringdevice, PCMD 200. PCMD 200 is similar to PCMD 100 except thatelectronics disc 206 is smaller than electronics disc 106 of PCMD 100and substrate 104. As in PCMD 100, the electronics disc 206 is separatedfrom substrate 104 in an extended position. PCMD 200 may come togetherwith (above or below) substrate 104 or may always remain extended. Thusthe electronics can be distanced from the deleterious conditions of theprocessing chamber. The electronics may be in a form factor other than adisc.

FIG. 3A illustrates yet another embodiment of a process conditionmeasuring device, PCMD 300. PCMD 300 is similar to PCMD 200 of FIG. 2but includes an additional electronics platform 207 upon the surface,into the surface or into a cavity of substrate 104. The electronic andpower supply circuitry 151 previously contained in electronics disc 106and 206 of PCMD 100 and 200 is now divided between electronics disc 206and electronics platform 207. Any portion of PCMD circuitry 151 shown inFIG. 1F can be at either location and may also be duplicated on eachplatform. Preferably, signal acquisition circuitry 154 is part ofelectronics platform 207 and data transmission circuitry 158 is presentat both electronics platform 207 and at electronics disc 206. Thus,communication to DPD 110 could be either from electronics platform 207or electronics disc 206. Electronics platform 207 may be anywhere uponthe surface of substrate 104. In this embodiment it is located in thecenter.

As can be seen in FIG. 3B, electronics platform 207 is elevated from thesurface of substrate 104 with one or more spacers or platform legs 209.As mentioned previously, a processing chamber may have rather largegradients in temperature and other parameters. In some cases, the mostsevere processing condition may be at the level of the wafer. Elevatingthe electronics from the surface of the wafer is another way ofisolating the electronics from the harshest processing conditions. Theplatform 207 and the platform leg(s) 209 are preferably made from amaterial with similar/compatible characteristics as substrate 104, butcould be made of virtually any material. Compatibility may relate tothermal coefficient of expansion, or other mechanical, electrical, ormaterial properties. The distance that platform 207 is elevated fromsubstrate 104 can be tailored depending on the processing conditionanticipated to be measured, but is generally from 1 mm to 5 mm. Platformlegs may range in size from 0.05 mm in diameter or width (if not round)to more than 1.0 mm and are preferably of a minimal diameter or width ofabout 0.05 mm diameter to limit heat transfer between the substrate andplatform. Signals from the electronic circuitry of platform 207 aretransferred to substrate 104 via either a small electrical cable orconductors integral to platform legs 209.

FIG. 4 illustrates PCMD 400, another embodiment of the invention. PCMD400 is similar to PCMD 300 except that it does not include electronicsdisc 206. Electronics platform 207 includes SAC 154 and DTC 158. Powersupply 162 is preferably located on platform 207 but may also be locatedon substrate 104. Cable 108 may extend outside the process chamber tofunction as an antenna, or external transducer, to support thetransceiver by allowing communications which would be prevented fromwithin the closed process chamber containing substrate 104 andelectronics platform 207. Cable 108 would thus act as part of data link112, in transmitting signals, real time or delayed, between DTC 158 andDPD 110. Alternatively, cable 108 can be connected directly to DPD 110,and thus data link 112 would be a wired link.

FIG. 5 illustrates PCMD 500, yet another embodiment of the invention.PCMD 500 lacks the cable 108 of PCMD 400 but is otherwise similar.Accordingly, PCMD 500 communicates wirelessly over data link 112. Anantenna is preferably integrated into electronics platform 207 but mayalso be formed in or upon substrate 104.

Thus far, in all of the embodiments featuring electronics platform 207,that is, PCMD 300, 400, and 500, the platform has been located in thecenter of substrate 104. This is because it is important to keep theprocess condition measuring device properly balanced as it may be spunor rotated by a robot arm. However, thermal balance is also important,as is the balance of many other processing conditions. As mentionedpreviously, a processing condition may vary greatly throughout theprocessing chamber. Each different processing condition has its ownprofile or gradient within the processing chamber. Thus, in order toaccommodate these variations it is advantageous to vary the location ofelectronics platform 207 depending on the processing condition, or tolocate more than one platform upon or into the substrate.

In FIG. 6, PCMD 600 has electronics platform 207 located near the edgeof substrate 207. Otherwise PCMD 600 is the same as PCMD 500. In FIG. 7,PCMD 700 has two or more electronics platforms 207 and 209 located on adiameter of substrate 104 and equally distanced from the center ofsubstrate 104. PCMD circuitry 151 may be divided in any proportionbetween electronics platform 207 and 209—including a configurationwherein platform 209 has no electronic components or circuitry. Also,the PCMD circuitry 151 may be duplicated on each platform.

In any embodiment a platform containing all or part of the PCMDcircuitry 151, i.e., memory 152, SAC 154, DTC 158, and power supply 162may be alternatively integrated into the substrate or contained within acavity formed within the substrate. This is done so that the substrate104 used to measure the processing conditions has substantially the samemass as a production substrate subject to the processing conditions ofactual production. The objective is to remove the same mass of substrateas added by the platform in order to accurately simulate the effects onas similar a test substrate (104) as possible. Dynamic thermal responsetimes to temperature changes can be most accurately measured if the massand thermal conduction within substrate 104 is similar to the productsubstrate.

While particular embodiments of the present invention and theiradvantages have been shown and described, it should be understood thatvarious changes, substitutions, and alterations can be made thereinwithout departing from the spirit and scope of the invention as definedby the appended claims. For example, the location and type of thesensors may be different than in the examples described. Additionally,the electronics platform or disc may be recessed into the a cavity ofthe measuring substrate, and circuitry that performs the same functionin the same way to get the same result is also within the scope of theinvention.

1. A system for sensing and recording or transmitting processingconditions comprising: a substrate having a surface, the substratecomprising sensors to measure the processing conditions of the substrateat different areas of the substrate; one or more electronics platformsmounted to the surface of the substrate comprising signal acquisitioncircuitry coupled to an output of the sensors; the one or moreelectronics platforms individually comprising at least one integratedcircuit; and wherein each of the one or more platforms comprise one ormore legs and a shelf, the one or more legs elevating the shelf from thesurface.
 2. The system of claim 1 wherein the signal acquisitioncircuitry is upon the shelf.
 3. The system of claim 1 wherein thesubstrate is a wafer.
 4. The system of claim 1 wherein the substratecomprises glass.
 5. The system of claim 1 further comprising a remotedata processing module.
 6. The system of claim 5 wherein the dataprocessing module comprises a microprocessor, a storage device, adisplay, and an input device.
 7. The system of claim 1 wherein theprocessing conditions measured by the sensors comprise one or more ofthe following conditions: temperature, pressure, flow rate, vibration,ion current density, ion current energy, and light energy density. 8.The system of claim 1 wherein the sensors are discrete sensors mountedin or on the wafer.
 9. The system of claim 1 wherein the sensors arepart of an integrated circuit formed in or on the wafer.
 10. The systemof claim 9 wherein the power supply comprises an inductive power source.11. The system of claim 1 wherein the electronics platform furthercomprises a power supply.
 12. The system of claim 1 further comprisingan antenna connected to the wafer and electrically coupled to the signalacquisition circuitry.
 13. A system for sensing and recording ortransmitting processing conditions comprising: a substrate having asurface, the substrate comprising sensors to measure the processingconditions of the substrate at different areas of the substrate; one ormore electronics platforms mounted to the surface of the substratecomprising signal acquisition circuitry coupled to an output of thesensors; wherein each of the one more platforms comprise one or morelegs and a shelf, the one or more legs elevating the shelf from thesurface wherein the electronics platform further comprises datatransmission circuitry comprising a transceiver, the data transmissioncircuitry operable to transmit the processing conditions in real timeduring measurement of the processing conditions to the data processingmodule via the transceiver.
 14. The system of claim 13 wherein thetransceiver transmits and receives RF signals.
 15. The system of claim13 wherein the transceiver transmits and receives IR signals.
 16. Thesystem of claim 13 wherein the transceiver inductively transmits andreceives.
 17. The system of claim 13 wherein the transceiver sonicallytransmits and receives.
 18. The system of claim 13 wherein the systemfurther comprises a data transmission cable and wherein the datatransmission circuitry transmits the processing conditions over thecable.
 19. The system of claim 13 wherein the data transmissioncircuitry is further operable to send and receive control signals to andfrom the data processing module.
 20. A system for sensing and recordingor transmitting processing conditions comprising: a substrate having asurface, the substrate comprising sensors to measure the processingconditions of the substrate at different areas of the substrate; one ormore electronics platforms mounted to the surface of the substratecomprising signal acquisition circuitry coupled to an output of thesensors; and wherein the electronics platform is mounted to a recessedportion of the surface of the substrate, wherein the recessed portionand the platform are within a cavity and wherein the platform issubstantially equal in mass to the removed cavity.
 21. A system forsensing processing conditions comprising: a substrate; a plurality ofsensors attached to the substrate; an electronics platform electricallycoupled to the plurality of sensors; the electronics platform includingat least one integrated circuit; the electronics platform mounted to thesubstrate by one or more leas that elevate the platform from thesubstrate; and a gap between the electronics platform and the substratewherein the gap is from 1 mm to 5 mm.
 22. A system for sensingprocessing conditions comprising: a substrate; a plurality of sensorsattached to the substrate; an electronics platform electrically coupledto the plurality of sensors; the electronics platform including at leastone integrated circuit; and the electronics platform mounted to thesubstrate by one or more legs that elevate the platform from the whereinthe one or more legs are between 1 mm to 5 mm in height and between 0.05mm and 1.0 mm in width.
 23. A system for sensing processing conditionscomprising: a substrate; a plurality of sensors attached to thesubstrate; an electronics platform electrically coupled to the pluralityof sensors; the electronics platform including at least one integratedcircuit; the electronics platform mounted to the substrate by one ormore legs that elevate the platform from the substrate; and anelectrical cable between the electronics platform and the substrate. 24.A system for sensing processing conditions comprising: a substrate; aplurality of sensors attached to the substrate; an electronics platformelectrically coupled to the plurality of sensors; the electronicsplatform including at least one integrated circuit; and the electronicsplatform mounted to the substrate by one or more legs that elevate theplatform from the substrate wherein the one or more legs insulate theplatform from high temperatures at the substrate.
 25. A system forsensing processing conditions comprising: a substrate; a plurality ofsensors attached to the substrate; an electronics platform electricallycoupled to the plurality of sensors; the electronics platformencompassing at least one integrated circuit; and the electronicsplatform mounted to the substrate by one or more lees that elevate theplatform from the substrate.
 26. The system of claim 25 furthercomprising a gap between the electronics platform and the substrate. 27.The system of claim 26 wherein the gap is from 1 mm to 5 mm.
 28. Thesystem of claim 25 wherein the one or more legs are between 1 mm and 5mm in height and between 0.05 mm and 1.0 mm in width.
 29. The system ofclaim 25 further comprising an electrical cable between the electronicsplatform and the substrate.
 30. The system of claim 25 furthercomprising electrical conductors integral to the one or more legs. 31.The system of claim 25 wherein the electronics platform is mounted tothe center of a surface of the substrate.
 32. The system of claim 25wherein the one or more legs insulate the platform from hightemperatures at the substrate.
 33. The system of claim 25 furthercomprising an additional electronics platform, the electronics platformand the additional electronics platform being equidistant from thecenter of the substrate along a diameter of the substrate.